The CPUs in phones have some sort of TIM (thermal interface material) applied to them, and are either in direct contact with the inner side of the case, or a heatpipe which dissipates the heat elsewhere, over a larger area.
This does nothing of that. It's just sitting there simmering nicely. The only reason i can think of is that they recycled most of a former model, and then shrank the cpu-board which then didn't reach unter the vent anymore.
But how did they even manage to oversee that during testing?
